Am29F400B Known Good Die

9

SU PP L E ME NT

REVISION SUMMARY

Revision B

Formatted to match current template. Updated Distinc-

tive Characteristics and General Description sections

using the current main data sheet. Updated for CS39

process technology.

Revision B+1

Distinctive Characteristics

The minimum guarante per sector is now 1 million

cycles.

Global

Added -75 and -90 speed options.

Pad Description

Corrected coordinates for pads 2, 19, 22, 35, 40, and

42.

Physical Specifications

Changed die thickness specification to ~20 mils.

Trademarks

Copyright © 1998 Advanced Micro Devices, Inc. All rights reserved.

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.