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MPQ4559DN bảng dữ liệu(PDF) 2 Page - Monolithic Power Systems |
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MPQ4559DN bảng dữ liệu(HTML) 2 Page - Monolithic Power Systems |
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2 / 19 page ![]() MPQ4559 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER AEC-Q100 QUALIFIED MPQ4559 Rev. 1.01 www.MonolithicPower.com 2 6/9/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking MPQ4559DN* SOIC8E MP4559DN MPQ4559DQ** QFN10 (3X3mm) ADD MPQ4559DQ-AEC1 QFN10 (3X3mm) ADD * For Tape & Reel, add suffix –Z (e.g. MPQ4559DN–Z) For RoHS Compliant Packaging, add suffix –LF (e.g. MPQ4559DN–LF–Z) * For Tape & Reel, add suffix –Z (e.g. MPQ4559DQ–Z) For RoHS Compliant Packaging, add suffix –LF (e.g. MPQ4559DQ–LF–Z) PACKAGE REFERENCE QFN10 SOIC8 (Exposed Pad) ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage (VIN).................... –0.3V to +60V Switch Voltage (VSW)............–0.5V to VIN + 0.5V BST to SW.................................... –0.3V to +5V All Other Pins................................ –0.3V to +5V Continuous Power Dissipation (TA = +25°C) (2) SOIC8E ……………………………………….2.5W QFN10 (3X3mm) …………………………….2.5W Junction Temperature .............................. 150 C Lead Temperature ................................... 260 C Storage Temperature.............. –65°C to +150 C Recommended Operating Conditions (3) Supply Voltage VIN .......................... 3.8V to 55V Output Voltage VOUT........................ 0.8V to 52V Operating Junct. Temp (TJ)..... –40C to +125C Thermal Resistance (4) θJA θJC SOIC8 (Exposed Pad) ............50 ...... 10 ... C/W QFN10 (3X3mm)………………50……12… C/W Notes: 1) Exceeding these ratings may damage the device 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal r esistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/ θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7 4-layer board. |
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