MP62181DD datasheet(2/12 Pages) MPS

2 / 12 page

MP62180/MP62181 –CURRENT-LIMITED POWER DISTRIBUTION SWITCH

MP62180_MP62181 Rev. 0.9

www.MonolithicPower.com

2/23/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number Enable Switch

Maximum

Continuous

Load Current

Typical Short-

Circuit Current

@ TA=25C

Package

Top

Marking

Free Air

Temperature (TA)

MP62180DS

SOIC8

62180DS

MP62180DD

QFN8E

(2mm x 3mm)

62180DD

MP62180DH

Active

Low

MSOP8E

62180DH

MP62181DS

SOIC8

62181DS

MP62181DD

QFN8E

(2mm x 3mm)

62181DD

MP62181DH

Active

High

Single

2.8A

MSOP8E

62181DH

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP62180DH–Z).

For RoHS Compliant Packaging, add suffix –LF (e.g. MP62180DH–L)

PACKAGE REFERENCE

TOP VIEW

GND

EN*

OUT

FLAG

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

TOP VIEW

GND

EN*

OUT

FLAG

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

GND

EN*

OUT

FLAG

TOP VIEW

MSOP8E

QFN8E (2mm x 3mm)

SOIC8

MP62180

*: EN is active high for MP62181

ABSOLUTE MAXIMUM RATINGS

(1)

IN .................................................-0.3V to +6.0V

EN, FLAG, OUT to GND ..............-0.3V to +6.0V

Continuous Power Dissipation (TA = +25°C)

(2)

MSOP8E.................................................... 2.3W

QFN8E (2mm x 3mm)................................ 2.3W

SOIC8 ........................................................ 1.4W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature...............–65°C to +150°C

Operating Temperature..............–40°C to +85°C

Thermal Resistance

(3)

θJA

θJC

MSOP8E................................. 55 ...... 12...

°C/W

QFN8E (2mm x 3mm) ............ 55 ...... 12...

°C/W

SOIC8..................................... 90 ...... 42...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) Measured on JESD51-7, 4-layer PCB.

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