MP62161DS datasheet(2/12 Pages) MPS

2 / 12 page

MP62160/MP62161 –CURRENT-LIMITED POWER DISTRIBUTION SWITCH

MP62160_MP62161 Rev. 0.9

www.MonolithicPower.com

7/8/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number Enable

Switch

Maximum

Continuous

Load Current

Typical Short-

Circuit Current

@ TA=25C

Package

Top

Marking

Free Air

Temperature

(TA)

MP62160DS

SOIC8

62160DS

MP62160DD

QFN8E

(2mm x 3mm)

62160DD

MP62160DH*

Active

Low

MSOP8E

62160DH

MP62161DS

SOIC8

62161DS

MP62161DD

QFN8E

(2mm x 3mm)

62161DD

MP62161DH

Active

High

Single

2.8A

MSOP8E

62161DH

-40

°C to +85°C

For Tape & Reel, add suffix –Z (e.g. MP62160DH–Z).

For RoHS Compliant Packaging, add suffix –LF (e.g. MP62160DH–L)

PACKAGE REFERENCE

TOP VIEW

GND

EN*

OUT

FLAG

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

TOP VIEW

GND

EN*

OUT

FLAG

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

GND

EN*

OUT

FLAG

TOP VIEW

MSOP8E

QFN8E (2mm x 3mm)

SOIC8

MP62160/MP62161

Single-Channel

(*: EN is active high for MP62161)

ABSOLUTE MAXIMUM RATINGS (1)

IN .................................................-0.3V to +6.0V

EN, FLAG, OUT to GND ..............-0.3V to +6.0V

Continuous Power Dissipation (TA = +25°C)

(2)

MSOP8E.................................................... 2.3W

QFN8E (2mm x 3mm)................................ 2.3W

SOIC8 ........................................................ 1.4W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature............... -65°C to +150°C

Operating Temperature.............. -40°C to +85°C

Thermal Resistance

(3)

θJA

θJC

MSOP8E................................. 55 ...... 12...

°C/W

QFN8E (2mm x 3mm) ............ 55 ...... 12...

°C/W

SOIC8..................................... 90 ...... 42...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) Measured on JESD51-7, 4-layer PCB.

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