MP8125DR datasheet(2/13 Pages) MPS

2 / 13 page

MP8125 – LNB POWER SUPPLY AND CONTROL VOLTAGE REGULATOR

MP8125 Rev. 1.11

www.MonolithicPower.com

5/9/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

Free Air Temperature (TA)

MP8125EF*

TSSOP-16

MP8125

-20

°C to +85°C

MP8125DR

QFN24(4x4mm)

MP8125

-40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP8125EF–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP8125EF–LF–Z)

PACKAGE REFERENCE

SGND

BYPASS

VDD

COMP

LINEDROP

POK

13V/18V

PGND

BST

VBOOST

VOUT

ILIMIT

TCAP

EXTM

TOP VIEW

VDD

COMP

LINEDROP

BST

VBOOST

VOUT

789

EXPOSED PAD

CONNECT TO GND

TSSOP-16

QFN24

ABSOLUTE MAXIMUM RATINGS (1)

VDD ................................................-0.3V to 16V

VOUT, SW, VBOOST ....................-0.3V to 25V

BST....................................................... VSW +7V

All Other Pins................................-0.3V to 6.5 V

Continuous Power Dissipation.….(TA=+25°C)

(2)

TSSOP-16……………………………………2.8W

QFN24(4x4mm)………………………………2.9W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature................. -65°C to 150

°C

Recommended Operating Conditions (3)

Supply Voltage VIN ..............................8V to 14V

Output Voltage VOUT............... 13V/14V/18V/19V

Maximum Junction Temp. (TJ) ...............+125°C

Thermal Resistance (4)

θJA

θJC

TSSOP-16...............................45 ....... 8 ....

°C/W

QFN24(4x4mm) ......................42 ....... 9 ....

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX),

the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7 4-layer PCB

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