MP4651ES datasheet(3/12 Pages) MPS

3 / 12 page

MP4651—OFF LINE LED DRIVER

MP4651 Rev.1.0

www.MonolithicPower.com

1/13/2011

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP4651ES

SOIC16

MP4651ES

-20

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP4651ES–Z)

For RoHS Compliant Packaging, add suffix –LF (e.g. MP4651ES–LF–Z)

PACKAGE REFERENCE

OVP

SYNC

SSD

GND

VCC

VIN

PWMIN

BFS

COMP

PWMOUT

FSET

TOP VIEW

PIN 1 ID

ABSOLUTE MAXIMUM RATINGS

(1)

Input Voltage VIN .......................................... 35V

GL, GR.........................................-0.3V to 10.7V

FB, SSD.......................................-5.8V to +5.8V

Other Pins....................................-0.3V to +6.5V

Continuous Power Dissipation

(TA = +25°C)

(2)

……………………………………………….2.5W

Junction Temperature...............................150

°C

Lead Temperature (Solder).......................260

°C

Operating Frequency .............. 20kHz to 150kHz

Storage Temperature............... -55

°C to +150°C

Recommended Operating Conditions

(3)

Input Voltage VIN .................................9V to 30V

Operating Frequency (Typical) ................ 50kHz

Maximum Junction Temp. (TJ) .............. +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC16 ...................................80 ...... 30 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB

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