MP2562DS datasheet(2/20 Pages) MPS

2 / 20 page

MP2562 – 1A, 4MHz, 50V STEP-DOWN CONVERTER

MP2562 Rev. 0.91

www.MonolithicPower.com

4/5/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

* For Tape & Reel, add suffix –Z (e.g. MP2562DQ–Z).

For RoHS Compliant Packaging, add suffix –LF (e.g. MP2562DQ–LF–Z)

** For Tape & Reel, add suffix –Z (e.g. MP2562DS–Z).

For RoHS Compliant Packaging, add suffix –LF (e.g. MP2562DS–LF–Z)

PACKAGE REFERENCE

TOP VIEW

COMP

BST

VIN

FREQ

GND

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

COMP

BST

VIN

FREQ

GND

TOP VIEW

QFN10

SOIC8

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage (VIN).....................–0.3V to +55V

Switch Voltage (VSW)...........................................

................-0.3V (-5V for <10ns) to VIN +0.3V

BST to SW .....................................–0.3V to +6V

All Other Pins.................................–0.3V to +6V

Continuous Power Dissipation. ….(TA=+25°C)

(2)

3x3 QFN10……………………………….….2.5W

SOIC8………………………….……………..1.3W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature................. –65°C to +150

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................4.5V to 50V

Output Voltage VOUT.........................0.8V to 47V

Operating Junct. Temp. .......... –40

°C to +125°C

Thermal Resistance

(4)

θJA

θJC

3x3 QFN10 ............................. 50 ...... 12...

°C/W

SOIC8..................................... 96 ...... 45...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage..

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7 4-layer board.

Part Number

Package

Top Marking

Free Air Temperature (TA)

MP2562DQ*

3x3 QFN10

–40

°C to +85°C

MP2562DS**

SOIC8

MP2562DS

–40

°C to +85°C

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