MP3399 datasheet(3/19 Pages) MPS

3 / 19 page

MP3399-12-STRING, CASCADING WHITE LED DRIVER WITH STEP-UP CONTROLLER

MP3399 Rev. 1.0

www.MonolithicPower.com

3/27/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

Free Air Temperature (TA)

MP3399EF*

TSSOP28

3399EF

-20

°C to +85°C

MP3399EY**

SOIC28

3399EY

-20

°C to +85°C

For Tape & Reel, add suffix –Z (eg. MP3399EF–Z).

For RoHS compliant packaging, add suffix –LF (eg. MP3399EF–LF–Z)

For Tape & Reel, add suffix –Z (eg. MP3399EY–Z).

For RoHS compliant packaging, add suffix –LF (eg. MP3399EY–LF–Z)

PACKAGE REFERENCE

DBRT

LED1

VCC

LED2

LED3

OVP

VIN

COMP

OSC

GND

ISET

BOSC

GATE

ISENSE

PGND

VFAULT

TOP VIEW

LED7

LED8

LED4

LED10

LED9

LED11

LED12

LED6

LED5

TSSOP28

SOIC28

ABSOLUTE MAXIMUM RATINGS

(1)

VIN .................................................-0.3V to +30V

VGATE ..............................................-0.5V to 6.8V

VVCC................................................-0.5V to 6.8V

VLED1 to VLED12 ..................................-1V to +50V

All Other Pins...............................-0.3V to +6.3V

Continuous Power Dissipation (TA = +25°C)

(2)

TSSOP28…………………………………...3.9 W

SOIC28………………………………………2.1W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature............... -65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ..............................5V to 28V

LED Current (Backlight) .............10mA to 60mA

Maximum Junction Temp. (TJ) ................+125°C

Thermal Resistance

(4)

θJA

θJC

TSSOP28................................32 ....... 6 ....

°C/W

SOIC28 ..................................60 ...... 30 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operation conditions.

4) Measured on JESD51-7, 4-layer PCB.

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