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MP2625GL bảng dữ liệu(PDF) 3 Page - Monolithic Power Systems |
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MP2625GL bảng dữ liệu(HTML) 3 Page - Monolithic Power Systems |
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3 / 28 page ![]() MP2625 – SINGLE CELL SWITCHING CHARGER WITH POWER PATH CONTROL MP2625 Rev. 1.12 www.MonolithicPower.com 3 10/29/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking MP2625GL QFN 3mmx4mm MP2625 * For Tape & Reel, add suffix –Z (e.g. MP2625GL–Z); PACKAGE REFERENCE TOP VIEW TMR 1 2 3 16 15 14 11 7 8 9 10 20 19 18 17 ILIM P GND EN NTC ISET CHGOK ACOK VCC BST VLIM M0 M1 SYS BATT 6 4 5 13 12 AGND IN SW SW SYSFB ABSOLUTE MAXIMUM RATINGS (1) IN, SW ........................................ -0.3V to +20V BATT, SYS .................................... -0.3V to +6V BST ............................................. -0.3V to +26V All Other Pins................................. -0.3V to +6V Continuous Power Dissipation (TA = +25°C) (2) QFN20 3mmx4mm ....................................2.6W Junction Temperature .............................. 150 C Lead Temperature ................................... 260 C Storage Temperature................. –65°C to 150°C Recommended Operating Conditions (3) Supply Voltage VIN .......................... 4.5V to 12V Operating Junction Temp. (TJ).... -40°C to +125°C Thermal Resistance (4) θJA θJC QFN20 3mmx4mm ................. 48 ...... 11... C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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