24AA02/24LC02B

DS21709G-page 16

© 2007 Microchip Technology Inc.

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

8

Pitch

e

0.65 BSC

Overall Height

A

–

–

1.20

Molded Package Thickness

A2

0.80

1.00

1.05

Standoff

A1

0.05

–

0.15

Overall Width

E

6.40 BSC

Molded Package Width

E1

4.30

4.40

4.50

Molded Package Length

D

2.90

3.00

3.10

Foot Length

L

0.45

0.60

0.75

Footprint

L1

1.00 REF

Foot Angle

φ

0°

–

8°

Lead Thickness

c

0.09

–

0.20

Lead Width

b

0.19

–

0.30

D

N

E

E1

NOTE 1

12

b

e

c

A

A1

A2

L1

L

φ

Microchip Technology Drawing C04-086B