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TS52001

Version 1.3

Specifications subject to change

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The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each

application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the

power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures

above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management

implementation in the application.

APPLICATION USING A SINGLE LAYER PCB

Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board

application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method

(solder paste or thermal conductive epoxy).

In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat.

IMPORTANT:

If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power

dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board.

Mold compound

Die

Epoxy Die attach

Exposed pad

Solder

Thermal Vias with Cu plating

Single Layer, 2oz Cu

Ground Layer, 1oz Cu

Signal Layer, 1oz Cu

Bottom Layer, 2oz Cu

20% Cu coverage

90% Cu coverage

5% - 10% Cu coverage

Note: NOT to Scale

Use as much Copper Area

as possible for heat spread

Package Thermal Pad

Package Outline