2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm

ILCX09 Series

09/23/13_B

Specifications subject to change without notice

Page 1

Connection Diagram

2.2

2.4

Recommended Pad Layout

Dimension Units: mm

1.1 Max.

6.0 +/- 0.15

2.9 +/- 0.2

5.2

2.0 typ.

Product Features:

Applications:

Low Cost SMD Package

Fibre Channel

Low Profile Package

Server & Storage

Compatible with Leadfree Processing

Sonet /SDH

802.11 / Wifi

T1/E1, T3/E3

* Not available at all frequencies. ** Not available for all temperature ranges.

Frequency

8 MHz to 100 MHz

ESR (Equivalent Series Resistance)

8 MHz – 48.0 MHz

36 MHz – 100 MHz (3

Shunt Capacitance (C0)

7 pF Max.

Frequency Tolerance @ 25

 C

30 ppm Standard (see Part Number Guide for more options)

Frequency Stability over

Temperature

50 ppm Standard (see Part Number Guide for more options)

Crystal Cut

AT Cut

Load Capacitance

18 pF Standard (see Part Number Guide for more options)

Drive Level

500 uW Max.

Aging

5 ppm Max. / Year Standard

Temperature

Operating

0

 C to +70 C Standard (see Part Number Guide for more

options)

Storage

-40

 C to +85 C Standard

Part Number Guide

Sample Part Number:

ILCX09 - FB1F18 - 20.000

Package

Tolerance

(ppm) at Room

Temperature

Stability

(ppm) over Operating

Temperature

Operating

Temperature Range

Mode

(overtone)

Load Capacitance

(pF)

Frequency

ILCX09 -

B = ±50 ppm

B = ±50 ppm

0 = 0°C to +50°C

F = Fundamental

18 pF Standard

Or Specify

- 20.000 MHz

F = ±30 ppm

F = ±30 ppm

1 = 0°C to +70°C

3 = 3

G = ±25 ppm

G = ±25 ppm

2 = -10°C to +60°C

H = ±20 ppm

H = ±20 ppm

3 = -20°C to +70°C

I = ±15 ppm

I = ±15 ppm**

5 = -40°C to +85°C

J = ±10 ppm*

J = ±10 ppm**

9 = -10°C to +50°C