ISO7140FCC datasheet(13/22 Pages) TI

13 / 22 page

100

200

300

400

350

450

500

100

150

200

Case Temperature – C

150

250

CC1 = VCC2 = 5.5V

CC1 = VCC2 = 3.6V

CC1 = VCC2 = 2.7V

ISO7131CC, ISO7140CC, ISO7140FCC

ISO7141CC, ISO7141FCC

www.ti.com

SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013

REGULATORY INFORMATION

VDE

CSA

CQC

Certified according to DIN EN

Recognized under 1577

Approved under CSA Component Certified according to GB 4943.1-

60747-5-2

Component Recognition Program Acceptance Notice

2011 and GB 8898:2011

Reinforced Insulation per CSA

60950-1-03 and IEC 60950-1

(2nd Ed.), 150 VRMS maximum

working voltage

Basic Insulation

Basic Insulation per CSA 60950-

Maximum Transient Overvoltage,

Basic Insulation, Altitude

≤

1-03 and IEC 60950-1 (2nd Ed.),

4242 VPK

Single protection, 2500 VRMS

(1)

5000m, Tropical Climate, 250

380 VRMS maximum working

Maximum Working Voltage, 566

VRMS maximum working voltage

voltage

VPK

Reinforced Insulation per CSA

61010-1-04 and IEC 61010-1

(2nd Edition), 150 VRMS

maximum working voltage

File number: 220991 (approval

File number: 40016131

File number: E181974

Report Number: Pending

pending)

(1)

Production tested

≥ 3000 Vrms for 1 second in accordance with UL 1577.

IEC SAFETY LIMITING VALUES

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system

failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

θJA = 104.5°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C

217

Safety input, output, or supply

DBQ-16

θJA = 104.5°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C

332

current

θJA = 104.5°C/W, VI = 2.7V, TJ = 150°C, TA = 25°C

443

Maximum case temperature

150

°C

The safety-limiting constraint is the absolute-maximum junction temperature specified in the Absolute Maximum

Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the

Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages.

The power is the recommended maximum input voltage times the current. The junction temperature is then the

ambient temperature plus the power times the junction-to-air thermal resistance.

Figure 5. DBQ-16

θJC Thermal Derating Curve

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