MP2107 datasheet(2/14 Pages) MPS

2 / 14 page

MP2107/MP2107A – 4A, 6V SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR

MP2107/MP2107A Rev. 1.1

www.MonolithicPower.com

10/13/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

Free Air Temperature (TA)

MP2107DQ*

QFN10 (3mm x 3mm)

-40

°C to +85°C

MP2107ADN**

SOIC8E

MP2107ADN

-40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP2107DQ–Z).

For RoHS Compliant packaging, add suffix –LF (e.g. MP2107DQ–LF–Z)

** For Tape & Reel, add suffix –Z (e.g. MP2107ADN–Z).

For RoHS Compliant packaging, add suffix –LF (e.g. MP2107ADN–LF–Z)

PACKAGE REFERENCE

TOP VIEW

GND

EN/SYNC

GND

POK

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

GND

EN/SYNC

VCC

TOP VIEW

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

ABSOLUTE MAXIMUM RATINGS (1)

IN to GND ....................................-0.3V to +6.5V

SW to GND ........................... -0.3V to VIN + 0.3V

................................-2.5V to VIN+2.5V for <50ns

FB, EN/SYNC, POK to GND...........-0.3V to +6.5V

BS to SW .....................................-0.3V to +6.5V

Continuous Power Dissipation (TA = +25°C)

(2)

QFN10 (3mm x 3mm) ................................ 2.5W

SOIC8E...................................................... 2.5W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature............... -65°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN .............................2.7V to 6V

Output Voltage VOUT..................0.8V to 0.9 x VIN

Operating Junct. Temp (TJ)...... -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

QFN10 (3mm x 3mm)............. 50 ...... 12...

°C/W

SOIC8E .................................. 50 ...... 10...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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