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MP2016DD bảng dữ liệu(PDF) 2 Page - Monolithic Power Systems |
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MP2016DD bảng dữ liệu(HTML) 2 Page - Monolithic Power Systems |
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2 / 10 page ![]() MP2016 – 42V, 30mA, LOW POWER, LINEAR REGULATOR MP2016 Rev.1.0 www.MonolithicPower.com 2 10/10/2011 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2011 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking Free Air Temperature (TA) MP2016DJ* TSOT23-5 |R2 -40 °C to +85°C MP2016DD** QFN-8 (2 x 3mm) R2 -40 °C to +85°C * For Tape & Reel, add suffix –Z (g. MP2016DJ–Z). For RoHS compliant packaging, add suffix –LF (e.g. MP2016DJ–LF–Z) ** For Tape & Reel, add suffix –Z (g. MP2016DD–Z). For RoHS compliant packaging, add suffix –LF (e.g. MP2016DD–LF–Z) PACKAGE REFERENCE TOP VIEW N/C VIN GND SHDN 1 2 3 4 N/C OUT FB N/C 8 7 6 5 EXPOSED PAD ON BACKSIDE CONNECTED TO GROUND PLAN TSOT23-5 QFN-8 (2mm x 3mm) ABSOLUTE MAXIMUM RATINGS (1) IN , SHDN ....................................–0.3V to +45V GND..................................... –0.3V to VIN + 0.3V FB .............................................–0.3V to + 1.5V Continuous Power Dissipation (TA = +25°C) (2) TSOT23-5………………………………...0.6.W QFN8 (2X3mm)………………………….2.3W Lead Temperature ....................................260 °C Storage Temperature.............. –65°C to +150 °C Recommended Operating Conditions (3) Supply Voltage VIN ..............................4V to 42V Output Voltage VOUT.........................1.2V to 40V Maximum Junction Temp. (TJ) ................+125°C Thermal Resistance (4) θJA θJC TSOT23-5 ..............................220 .... 110 .. °C/W QFN8 (2 x 3mm) .....................55 ...... 12 ... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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