THS3115IPWPRG4 datasheet(18/35 Pages) TI1

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100

Free-AirTemperature( C)

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

T =+125

=158

=95

=58.4

THS3112

THS3115

SLOS385C – SEPTEMBER 2001 – REVISED SEPTEMBER 2010

www.ti.com

For systems where heat dissipation is more critical,

the THS3115 and THS3112 are also available in an

8-pin MSOP with PowerPAD package that offers

even

better

thermal

performance.

The

thermal

coefficient

for

the

PowerPAD

packages

are

substantially improved over the traditional SOIC.

Maximum power dissipation levels are depicted in

Figure 52 for the available packages. The data for the

PowerPAD packages assume a board layout that

follows the PowerPAD layout guidelines discussed

above and detailed in the PowerPAD application note

(literature

number

SLMA002).

Figure

also

illustrates the effect of not soldering the PowerPAD to

PCB.

The

thermal

impedance

increases

substantially, which may cause serious heat and

performance issues. Always solder the PowerPAD to

Results shown are with no air flow and PCB size of 3 in × 3 in

the PCB for optimum performance.

(76,2 mm × 76,2 mm).

When determining whether or not the device satisfies

•

qJA = 58.4°C/W for 8-pin MSOP with PowerPAD (DGN

the maximum power dissipation requirement, it is

package)

important to not only consider quiescent power

•

qJA = 95°C/W for 8-pin SOIC High-K test PCB (D package)

dissipation, but also dynamic power dissipation. Often

•

qJA = 158°C/W for 8-pin MSOP with PowerPAD without solder

times, this type of dissipation is difficult to quantify

Figure 52. Maximum Power Dissipation vs

because the signal pattern is inconsistent, but an

Ambient Temperature

estimate of the RMS power dissipation can provide

visibility into a possible problem.

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Product Folder Link(s): THS3112 THS3115

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