Copyright

© ANPEC Electronics Corp.

Rev. A.6 - Mar., 2013

www.anpec.com.tw

2

APL3203D

Ordering and Marking Information

Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Symbol

Parameter

Rating

Unit

IN Input Voltage (IN pin to GND)

-0.3 to 30

V

OUT, BAT Pins to GND Voltage

-0.3 to 7

V

ILIM, FAULT, EN, Pins to GND Voltage

-0.3 to 7

V

OUT Output Current

2

A

Maximum Junction Temperature

150

Storage Temperature Range

-65 to 150

Maximum Lead Soldering Temperature,10 Seconds

260

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction to Ambient Thermal Resistance in Free Air

(Note 2)

TDFN2x2-8

80

°C/W

Recommended Operating Conditions

Symbol

Parameter

Range

Unit

IN Input Voltage

4.5 to 5.5

V

OUT Output Current

0 to 1.5

A

Junction Temperature

-40 to 125

°C

Ambient Temperature

-40 to 85

°C

Note 2 :

θ

Package Code

QB : TDFN2x2-8

Operating Ambient Temperature Range

I : -40 to 85

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

Handling Code

Temperature Range

Package Code

APL3203D QB:

X - Date Code

Assembly Material

L03D

X

APL3203D