PR01/02/03

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Vishay BCcomponents

Revision: 24-Jun-13

13

Document Number: 28729

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

APPLICATION INFORMATION

PR03 Impedance as a function of applied frequency

TESTS AND REQUIREMENTS

Essentially all tests are carried out in accordance with

IEC 60115-1 specification, category LCT/UCT/56 (rated

temperature range: Lower Category Temperature, Upper

Category Temperature; damp heat, long term, 56 days).

The tests are carried out in accordance with IEC 60068-2-xx

Test Method under standard atmospheric conditions

according to IEC 60068-1, 5.3.

In the Test Procedures and Requirements table, tests

and requirements are listed with reference to the relevant

clauses of IEC 60115-1 and IEC 60068-2-xx test methods.

A short description of the test procedure is also given. In

some instances deviations from the IEC recommendations

were necessary for our method of specifying.

All soldering tests are performed with mildly activated flux.

10

1

1

10

Z

R

f (MHz)

= 18

Ω

n

= 1.3 k

Ω

n

= 20 k

Ω

n

= 1.5

Ω

= 100 k

Ω

n

n

R

R

R

R

R

TEST PROCEDURES AND REQUIREMENTS

IEC

60115-1



CLAUSE

IEC

60068-2-

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

4.4.1

Visual examination

No holes; clean surface; no damage

4.4.2

Dimensions (outline)

Gauge (mm)

See Straight and Kinked Dimensions

tables 

4.5

Resistance

(refer note on first

page for measuring

distance)

Applied voltage (+ 0 %/- 10 %):

R< 10 

:  0.1 V

10 

  R < 100 : 0.3 V

100 

  R < 1 k: 1 V

1 k

  R < 10 k: 3 V

10 k

  R < 100 k: 10 V

100 k

  R < 1 M: 25 V

R = 1 M

: 50 V

4.18

20 (Tb)

Resistance to

soldering heat

Thermal shock: 10 s; 260 °C; 3 mm from body

R

4.29

45 (Xa)

Component solvent

resistance

followed by brushing

No visual damage

4.17

20 (Ta)

Solderability

2 s; 235 °C; Solder bath method; SnPb40

3 s; 245 °C; Solder bath method; SnAg3Cu0.5

Good tinning (

 95 % covered);

no damage

Solderability

(after ageing)

8 h steam or 16 h 155 °C;

leads immersed 6 mm:

for 2 s at 235 °C; solder bath (SnPb40)

for 3 s at 245 °C; solder bath (SnAg3Cu0.5)

Good tinning (

 95 % covered);

no damage