Copyright

© ANPEC Electronics Corp.

Rev. A.3 - Sep., 2012

APW8811

www.anpec.com.tw

3

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance - Junction to Ambient

52

θ

JC

Thermal Resistance - Junction to Case

7

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note 2:

θ

thermal pad of package is soldered directly on the PCB.

Symbol

Parameter

Rating

Unit

Input Power Voltage (VIN to GND)

-0.3 ~ 28

V

BOOT Supply Voltage (BOOT to PHASE)

-0.3 ~ 7

V

BOOT Supply Voltage (BOOT to GND)

-0.3 ~ 35

V

UGATE Voltage (UGATE to PHASE)

<400ns pulse width

>400ns pulse width

V

LGATE Voltage (LGATE to GND)

<400ns pulse width

>400ns pulse width

V

PHASE Voltage (PHASE to GND)

<400ns pulse width

>400ns pulse width

-5 ~ 35

-0.3 ~ 28

V

All Other Pins (LDOx, FBx, VOUTx, LDO5, LDO3, REF, ILIMx, EN

LDO, EN PWM to GND)

-0.3 ~ 6

V

Maximum Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Recommended Operating Conditions

Symbol

Parameter

Range

Unit

PWM1/2 Converter Input Voltage

6 ~ 25

V

PWM1 Converter Output Voltage

2 ~ 5.5

V

PWM2 Converter Output Voltage

2 ~ 5.5

V

PWM1/2 Converter Input Capacitor (MLCC)

10 ~

µF

LDO Output Capacitor (MLCC)

2.2 ~

µF

Ambient Temperature

-40 ~ 85

Junction Temperature

-40 ~ 125