Copyright

© ANPEC Electronics Corp.

Rev. A.2 - Oct., 2012

APW7165C

www.anpec.com.tw

2

Ordering and Marking Information

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Symbol

Parameter

Rating

Unit

VCC Supply Voltage (VCC to GND)

-0.3 ~ 16

V

BOOT to PHASE Voltage

-0.3 ~ 16

V

> 400ns

V

UGATE to PHASE Voltage

< 400ns

V

> 400ns

V

LGATE to GND Voltage

< 400ns

V

> 200ns

-0.3 ~ 16

V

PHASE to GND Voltage

< 200ns

-10 ~ 30

V

-0.3 ~ 7

V

Maximum Junction Temperature

150

°C

Storage Temperature

-65 ~ 150

°C

Maximum Lead Soldering Temperature, 10 Seconds

260

°C

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance -Junction to Ambient

(Note 2)

SOP-8P

80

°C/W

θ

JC

Thermal Resistance -Junction to Case

SOP-8P

20

°C/W

Thermal Characteristics

Note 2 :

θ

APW7165C

Handling Code

Temperature Range

Package Code

Assembly Material

APW7165C KA:

XXXXX - Date Code

Package Code

KA : SOP-8P

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

APW7165C

XXXXX