Copyright

© ANPEC Electronics Corp.

Rev. B.8 - Jan., 2012

APL1581

www.anpec.com.tw

2

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Note 2 : The maximum allowable power dissipation at any T

(max) = (T

= 125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature.

Symbol

Parameter

Rating

Unit

Input Voltage

7

V

Control Voltage

7

V

Power Dissipation

Internally Limited

W

Junction Temperature

150

°C

Storage Temperature Range

-65 to +150

°C

Maximum Lead Soldering Temperature, 10 Seconds

260

°C

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in free air

(Note 3)

TO-263-5 (Toplayer plane size : 15mm x 15 mm)

TO-252-4/TO-252-5 (Toplayer plane size : 10mm x 10 mm)

SOP-8P (Toplayer plane size : 10mm x 10 mm)

28

42

68

Pin Configuration

Front View of TO-263-5

Front View of TO-252-5

VSENSE

ADJ (or GND)

VOUT

VCNTL

VIN

1

2

3

4

5

TAB is VOUT

VIN

VCNTL

VOUT

ADJ(or GND)

VSENSE

1

2

3

4

5

TAB is VOUT

SOP-8P (Top View)

NC = No internal connection

= Thermal Pad

(connected to VOUT plane for better heat

dissipation)

Pin 5~8 must be connected together by a shortest

wide track or plane.

1

2

3

4

5

6

7

8

VSENSE

ADJ (or GND)

VCNTL

VIN

VOUT

VOUT

VOUT

VOUT

Front View of TO-252-4

VSENSE

ADJ

VIN

VCNTL

TAB is VOUT

1

2

3

4