SMP18

REV. C

–3–

PIN CONNECTIONS

14

13

12

11

16

15

10

9

8

1

2

3

4

7

6

5

TOP VIEW

(Not to Scale)

SMP18

INPUT

B CONTROL

A CONTROL

INH

DGND

C CONTROL

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

SMP18FP

–40

°C to +85°C

Plastic DIP

N-16

SMP18FRU

–40

°C to +85°C

TSSOP-16

RU-16

SMP18FS

–40

°C to +85°C

SO-16

R-16A

ABSOLUTE MAXIMUM RATINGS

Analog Output Current . . . . . . . . . . . . . . . . . . . . . . .

±20 mA

(Not short-circuit protected)

Operating Temperature Range

FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300

°C

Package Type

JC

Units

16-Pin Plastic DIP (P)

76

33

°C/W

16-Pin SOIC (S)

92

27

°C/W

16-Lead TSSOP (RU)

180

35

°C/W

NOTES

*

θ

in socket for plastic DIP packages;

θ

circuit board for SOIC and TSSOP packages.

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the SMP18 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.