ADP1712/ADP1713/ADP1714

Rev. A | Page 14 of 16

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

140

0

0.5

5.0

120

100

80

60

40

20

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

1mA

10mA

30mA

80mA

100mA

200mA

300mA

(LOAD CURRENT)

140

0

0.5

5.0

120

100

80

60

40

20

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

1mA

10mA

30mA

80mA

100mA

200mA

300mA

(LOAD CURRENT)

140

0

0.5

5.0

120

100

80

60

40

20

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

1mA

10mA

30mA

80mA

100mA

200mA

300mA

(LOAD CURRENT)

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP1712/

ADP1713/ADP1714. However, as can be seen from Table 5, a

point of diminishing returns eventually is reached, beyond

which an increase in the copper size does not yield significant

heat dissipation benefits.

Place the input capacitor as close as possible to the IN and GND

pins. Place the output capacitor as close as possible to the OUT

and GND pins. For the ADP1712 adjustable version, place the

soft-start capacitor as close as possible to the SS pin. For the

ADP1713, place the internal reference bypass capacitor as close

as possible to the BYP pin. Use of 0402 or 0603 size capacitors

and resistors achieves the smallest possible footprint solution on

boards where area is limited.

GND (BOTTOM)

GND (TOP)

IN

EN

R2

R1

C3

OUT

C2

C1

ADP1712/

ADP1713/

ADP1714

SS/

ADJ/

BYP/

TRK

Figure 39. Example PCB Layout