DSPIC30F2011AT-30ESLASHPF datasheet(215/228 Pages) MICROCHIP

215 / 228 page

DS70117F-page 213

dsPIC30F6011/6012/6013/6014

80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

#leads = n1

(F)

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

.630 BSC

NOM

INCHES

.630 BSC

.551 BSC

Overall Width

Overall Length

Foot Angle

Foot Length

Pins per Side

Overall Height

Number of Pins

Lead Width

Revised 7-20-06

Lead Thickness

Molded Package Thickness

* Controlling Parameter

JEDEC Equivalent: MS-026

Mold Draft Angle Bottom

Mold Draft Angle Top

Molded Package Width

Molded Package Length

Footprint

Notes:

Pitch

Standoff

Dimension Limits

11°

.011

.004

.018

0°

MIN

Units

.037

.002

12°

.013

3.5°

.039 REF.

.024

.015

.008

13°

.030

7°

.026

.039

.041

.006

.047

MAX

16.00 BSC

14.00 BSC

0.27

0.09

0.45

0°

0.32

1.00 REF.

0.60

3.5°

MILLIMETERS*

0.95

0.05

MIN

0.65

1.00

NOM

0.37

0.20

0.75

7°

1.05

0.15

1.20

MAX

13°

12°

11°

12°

11°

13°

12°

13°

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

Drawing No. C04-116

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