5

Regulatory Information

The HCPL-2602/2612 have been

approved by the following

organizations:

UL

Recognized under UL 1577,

Component Recognition Program,

File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

Solder Reflow Thermal Profile

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

Recommended Pb-Free IR Profile

217 °C

RAMP-DOWN

6 °C/SEC. MAX.

RAMP-UP

3 °C/SEC. MAX.

150 - 200 °C

260 +0/-5 °C

t 25 °C to PEAK

60 to 150 SEC.

20-40 SEC.

TIME WITHIN 5 °C of ACTUAL

PEAK TEMPERATURE

tp

ts

PREHEAT

60 to 180 SEC.

tL

TL

Tsmax

Tsmin

25

Tp

TIME

NOTES:

THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.

Tsmax = 200 °C, Tsmin = 150 °C

Insulation and Safety Related Specifications

Parameter

Symbol

Value

Units

Conditions

Min. External Air Gap

L(I01)

7.1

mm

Measured from input terminals to output terminals,

(External Clearance)

shortest distance through air.

Min. External Tracking

L(I02)

7.4

mm

Measured from input terminals to output terminals,

Path (External Creepage)

shortest distance path along body.

Min. Internal Plastic

0.08

mm

Through insulation distance, conductor to conductor,

Gap (Internal Clearance)

usually the direct distance between the photoemitter

and photodetector inside the optocoupler cavity.

Tracking Resistance

CTI

200

V

DIN IEC 112/VDE 0303 Part 1

(Comparative Tracking

Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

Note: Non-halide flux should be used.

Note: Non-halide flux should be used.