AD8628ART datasheet(5/24 Pages) AD

5 / 24 page

AD8628/AD8629/AD8630

Rev. I | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

6 V

Input Voltage

GND – 0.3 V to VS + 0.3 V

Differential Input Voltage1

±5.0 V

Output Short-Circuit Duration to GND

Indefinite

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Junction Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

ESD AD8628

HBM 8-Lead SOIC

±7000V

FICDM 8-Lead SOIC

±1500V

FICDM 5-Lead TSOT

±1000V

MM 8-Lead SOIC

±200V

ESD AD8629

HBM 8-Lead SOIC

±4000V

FICDM 8-Lead SOIC

±1000V

ESD AD8630

HBM 14-Lead SOIC

±5000V

FICDM 14-Lead SOIC

±1500V

FICDM 14-Lead TSSOP

±1500V

MM 14-Lead SOIC

±200V

1 Differential input voltage is limited to ±5 V or the supply voltage, whichever

is less.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

θJA is specified for worst-case conditions, that is, θJA is specified

for the device soldered in a circuit board for surface-mount

packages. This was measured using a standard two-layer board.

Table 4.

Package Type

θJA

θJC

Unit

5-Lead TSOT (UJ-5)

207

°C/W

5-Lead SOT-23 (RJ-5)

230

146

°C/W

8-Lead SOIC_N (R-8)

158

°C/W

8-Lead MSOP (RM-8)

190

°C/W

14-Lead SOIC_N (R-14)

105

°C/W

14-Lead TSSOP (RU-14)

148

°C/W

ESD CAUTION

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