PIC12F508ESLASHMC datasheet(91/110 Pages) MICROCHIP

91 / 110 page

DS41236E-page 91

PIC12F508/509/16F505

12.0

PACKAGING INFORMATION

12.1

Package Marking Information

8-Lead SOIC (3.90 mm)

XXXXXXXX

XXXXYYWW

NNN

Example

12F509-I

/SN

0610

017

8-Lead MSOP

XXXXXX

YWWNNN

Example

12F509

0610017

X X X

Y W W

N N

8-Lead 2x3 DFN*

B E Q

6 1 0

1 7

Example

XXXXXNNN

8-Lead PDIP

XXXXXXXX

YYWW

017

Example

12F508-I

0610

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

Standard PIC® device marking consists of Microchip part number, year code, week code, and traceability

code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip

Sales Office. For QTP devices, any special marking adders are included in QTP price.

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

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