MCP25050TISLASHP datasheet(51/66 Pages) MICROCHIP

51 / 66 page

DS21664D-page 51

MCP2502X/5X

9.0

ELECTRICAL CHARACTERISTICS

9.1

Absolute Maximum Ratings†

Ambient temperature under bias............................................................................................................. -55°C to +125°C

Storage temperature ............................................................................................................................... -65°C to +150°C

Voltage on any pin with respect to Vss (except VDD and RST)....................................................... -0.3V to (VDD + 0.6V)

VDD................................................................................................................................................................... 0V to 7.0V

Voltage on RST with respect to Vss.................................................................................................................. 0V to 14V

Total power dissipation (Note 1) .............................................................................................................................. 1.0 W

Maximum source current out of VSS pin ............................................................................................................... 300 mA

Maximum sink current into VDD pin ....................................................................................................................... 250 mA

Input clamp current, Iik (Vi < 0 or Vi > VDD) .......................................................................................................... ±20 mA

Output clamp current, Iok (VO < 0 or VO > VDD).................................................................................................... ±20 mA

Maximum current sunk by any I/O pin..................................................................................................................... 25 mA

Maximum current sourced by any input pin ............................................................................................................ 25 mA

Maximum current sunk by GPIO port.................................................................................................................... 200 mA

Maximum current sourced by GPIO port ..............................................................................................................200 mA

Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C

ESD protection on all pins

.................................................................................................................................................. ≥ 3.5 kV

Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD -

∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)

FIGURE 9-1:

MCP2505X VOLTAGE-FREQUENCY GRAPH

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

Frequency

6.0V

5.5V

4.5V

4.0V

2.0V

25 MHz

5.0V

3.5V

3.0V

2.7V

Fmax = (9.44 MHz/V) (VDDAPPMIN - 2.7V) + 8 MHz

Note: VDDAPPMIN is the minimum voltage of the MCP2505X device in the application.

8MHz

4.5V

MCP2505X

Characterized and not 100% tested.

MCP25050TI/P bảng dữ liệu(PDF) 51 Page - Microchip Technology

MCP25050TI/P bảng dữ liệu(HTML) 51 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66

bảng dữ liệu tải về

Link URL