STPS8L30

Packaging information

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Figure 11.

DPAK footprint dimensions (in mm)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 5.

IPAK Dimensions

REF.

DIMENSIONS

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

2.20

2.40

0.086

0.094

A1

0.90

1.10

0.035

0.043

A3

0.70

1.30

0.027

0.051

B

0.64

0.90

0.025

0.035

B2

5.20

5.40

0.204

0.212

B3

0.95

0.037

B5

0.30

0.035

C

0.45

0.60

0.017

0.023

C2

0.48

0.60

0.019

0.023

D

6

6.20

0.236

0.244

E

6.40

6.60

0.252

0.260

e

2.28

0.090

G

4.40

4.60

0.173

0.181

H

16.10

0.634

L

9

9.40

0.354

0.370

L1

0.8

1.20

0.031

0.047

L2

0.80

1

0.031 0.039

V1

10°

10°

6.7

6.7

3

3

1.6

1.6

2.3

2.3

H

L

L1

G

e

B5

B

V1

D

C

A1

A3

A

C2

B3

L2

E

B2