TDA8950J datasheet(19/39 Pages) PHILIPS

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TDA8950_2

Product data sheet

Rev. 02 — 11 June 2009

19 of 39

NXP Semiconductors

TDA8950

× 150 W class-D power ampliﬁer

13.5 Heatsink requirements

An external heatsink must be connected to the TDA8950.

Equation 5 deﬁnes the relationship between maximum power dissipation before activation

of TFB and total thermal resistance from junction to ambient.

(5)

Power dissipation (P) is determined by the efﬁciency of the TDA8950. Efﬁciency

measured as a function of output power is given in Figure 20. Power dissipation can be

derived as a function of output power as shown in Figure 19.

(1) Rth(j-a) = 5 K/W.

(2) Rth(j-a) = 10 K/W.

(3) Rth(j-a) = 15 K/W.

(4) Rth(j-a) = 20 K/W.

(5) Rth(j-a) = 35 K/W.

Fig 9.

Derating curves for power dissipation as a function of maximum ambient

temperature

th ja

–

()

amb

–

------------------------

(W)

Tamb (°C)

(1)

(2)

(3)

(4)

(5)

100

mbl469

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