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MPC5604E bảng dữ liệu(PDF) 26 Page - Freescale Semiconductor, Inc

tên linh kiện MPC5604E
Giải thích chi tiết về linh kiện  MPC5604E Microcontroller Data Sheet
PDF  75 Pages
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
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MPC5604E bảng dữ liệu(HTML) 26 Page - Freescale Semiconductor, Inc

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MPC5604E Microcontroller Data Sheet, Rev. 4
Electrical characteristics
Freescale Semiconductor
26
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects
of the thermocouple wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134
U.S.A.
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or
303-397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
1. C.E. Triplett and B. Joiner, An Experimental Characterization of a 272 PBGA Within an Automotive Engine Controller
Module, Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
2. G. Kromann, S. Shidore, and S. Addison, Thermal Modeling of a PBGA for Air-Cooled Applications, Electronic
Packaging and Production, pp. 53-58, March 1998.
3. B. Joiner and V. Adams, Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in
Thermal Modeling, Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
3.6
Electromagnetic Interference (EMI) characteristics
Table 10. EMI Testing Specifications1
1 EMI testing and I/O port waveforms per standard IEC61967-2.
Symbol
Parameter
Conditions
Clocks
Frequency
Range
Level
(Typ)
Unit
Radiated
emissions
VEME
VDD = 3.3 V
TA =+25 °C
Device
Configuration, test
conditions and EM
testing per standard
IEC61967-2.
Oscillator Frequency = 8
MHz;
System Bus Frequency =
64 MHz;
CPU Freq = 64MHZ
No PLL Frequency
Modulation
150 kHz–50 MHz
2
dB
V
50–150 MHz
14
150–500 MHz
11
500–1000 MHz
7
IEC Level
M
External Oscillator Freq =
8 MHz
System Bus Freq = 64
MHz
CPU Freq = 64MHZ
2% PLL Freq Modulation
150 kHz–50 MHz
1
dB
V
50–150 MHz
11
150–500 MHz
7
500–1000 MHz
1
IEC Level
N



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