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MPC8245EC bảng dữ liệu(PDF) 52 Page - Freescale Semiconductor, Inc |
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MPC8245EC bảng dữ liệu(HTML) 52 Page - Freescale Semiconductor, Inc |
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52 / 68 page ![]() MPC8245 Integrated Processor Hardware Specifications, Rev. 10 52 Freescale Semiconductor System Design Wakefield Engineering 603-635-5102 33 Bridge St. Pelham, NH 03076 Internet: www.wakefield.com Selection of an appropriate heat sink depends on thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Other heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, and Wakefield Engineering offer different heat sink-to-ambient thermal resistances and may or may not need airflow. 7.8.1 Internal Package Conduction Resistance The intrinsic conduction thermal resistance paths for the TBGA cavity-down packaging technology shown in Figure 29 are as follows: • Die junction-to-case thermal resistance • Die junction-to-ball thermal resistance Figure 29 depicts the primary heat transfer path for a package with an attached heat sink mounted on a printed-circuit board. Figure 29. TBGA Package with Heat Sink Mounted to a Printed-Circuit Board In a TBGA package, the active side of the die faces the printed-circuit board. Most of the heat travels through the die, across the die attach layer, and into the copper spreader. Some of the heat is removed from the top surface of the spreader through convection and radiation. Another percentage of the heat enters the printed-circuit board through the solder balls. The heat is then removed from the exposed surfaces of the board through convection and radiation. If a heat sink is used, a larger percentage of heat leaves through the top side of the spreader. External Resistance External Resistance Internal Resistance Radiation Convection Radiation Convection Heat Sink Printed-Circuit Board Thermal Interface Material Package/Leads Die Junction Die/Package (Note the internal versus external package resistance) |
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