FV80503CSM66166 datasheet(3/62 Pages) INTEL

3 / 62 page

Datasheet

Low-Power Embedded Pentium® Processor with MMX™ Technology

Contents

1.0

Introduction ..................................................................................................................7

1.1

Processor Features ............................................................................................... 7

2.0

Architecture Overview .............................................................................................8

2.1

Pentium® Processor Family Architecture .............................................................. 9

2.2

Pentium® Processor with MMX™ Technology .................................................... 12

2.2.1

Full Support for Intel MMX™ Technology .............................................. 12

2.2.2

16-Kbyte Code and Data Caches........................................................... 13

2.2.3

Improved Branch Prediction ................................................................... 13

2.2.4

Enhanced Pipeline ................................................................................. 13

2.2.5

Deeper Write Buffers.............................................................................. 13

2.3

0.25 Micron Technology ...................................................................................... 13

3.0

Packaging Information...........................................................................................14

3.1

Differences from Desktop Processors................................................................. 14

3.2

PPGA Pinout and Pin Descriptions .....................................................................15

3.3

HL-PBGA Pinout and Pin Descriptions ...............................................................19

3.4

Design Notes....................................................................................................... 23

3.5

Pin Quick Reference ........................................................................................... 23

3.6

Bus Fraction (BF) Selection ................................................................................ 29

3.7

The CPUID Instruction ........................................................................................ 30

3.8

Boundary Scan Chain List................................................................................... 32

3.9

Pin Reference Tables.......................................................................................... 33

3.10

Pin Grouping According to Function.................................................................... 35

3.11

Mechanical Specifications ................................................................................... 36

3.11.1 PPGA Package Mechanical Diagrams................................................... 36

3.11.2 HL-PBGA Package Mechanical Diagrams ............................................. 38

3.12

Thermal Specifications ........................................................................................ 39

3.12.1 Measuring Thermal Values .................................................................... 39

3.12.2 Thermal Equations and Data.................................................................. 39

3.12.3 Airflow Calculations for Maximum and Typical Power............................ 40

3.12.4 PPGA Package Thermal Resistance Information .................................. 41

3.12.5 HL-PBGA Package Thermal Resistance Information............................. 42

4.0

Electrical Specifications........................................................................................43

4.1

Absolute Maximum Ratings................................................................................. 43

4.2

DC Specifications ................................................................................................ 43

4.2.1

Power Sequencing ................................................................................. 43

4.3

AC Specifications ................................................................................................ 46

4.3.1

Power and Ground ................................................................................. 46

4.3.2

Decoupling Recommendations .............................................................. 46

4.3.3

Connection Specifications ...................................................................... 47

4.3.4

AC Timings............................................................................................. 47

4.4

I/O Buffer Models ................................................................................................ 55

4.4.1

Buffer Model Parameters ....................................................................... 56

4.5

Signal Quality Specifications ............................................................................... 58

4.5.1

Overshoot ...............................................................................................58

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