Data Sheet

ADMP411

Rev. 0 | Page 9 of 12

PCB LAND PATTERN LAYOUT

The recommended PCB land pattern for the ADMP411 is laid

out to a 1:1 ratio to the solder pads on the microphone package,

as shown in Figure 13. Take care to avoid applying solder paste

to the sound hole in the PCB. A suggested solder paste stencil

pattern layout is shown in Figure 14. The diameter of the sound

hole in the PCB should be larger than the diameter of the sound

port of the microphone. A minimum diameter of 0.5 mm is

recommended.

Figure 13. PCB Land Pattern Layout (Dimensions Shown in Millimeters)

Figure 14. Suggested Solder Paste Stencil Pattern Layout

2.62

ø1.10

ø1.68

ø0.70 (2×)

ø0.90 (3×)

2.40

1.20

2.54

0.79

1.27

1.27mm

1.2mm

2.54mm

2.62mm

3.41mm

2.4mm

0.85mm DIA. (3×)

1.8mm/1.3mm DIA. 0.2032 CUT WIDTH (4×)

0.649mm DIA. (2×)