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FDMS8026S bảng dữ liệu(PDF) 2 Page - List of Unclassifed Manufacturers |
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FDMS8026S bảng dữ liệu(HTML) 2 Page - List of Unclassifed Manufacturers |
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2 / 8 page ![]() www.fairchildsemi.com 2 ©2010 Fairchild Semiconductor Corporation FDMS8026S Rev.C1 Electrical Characteristics T J = 25°C unless otherwise noted Off Characteristics On Characteristics Dynamic Characteristics Switching Characteristics Drain-Source Diode Characteristics Symbol Parameter Test Conditions Min Typ Max Units BVDSS Drain to Source Breakdown Voltage ID = 1 mA, VGS = 0 V30 V ΔBV DSS ΔT J Breakdown Voltage Temperature Coefficient ID = 10 mA, referenced to 25°C 23 mV/°C IDSS Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V500 μA IGSS Gate to Source Leakage Current, Forward VGS = 20 V, VDS = 0 V 100 nA VGS(th) Gate to Source Threshold Voltage VGS = VDS, ID = 1 mA 1.2 1.5 3.0 V ΔV GS(th) ΔT J Gate to Source Threshold Voltage Temperature Coefficient ID = 10 mA, referenced to 25°C -4 mV/°C rDS(on) Static Drain to Source On Resistance VGS = 10 V, ID = 19 A 3.6 4.3 m Ω VGS = 4.5 V, ID = 17 A4.5 5.2 VGS = 10 V, ID = 19 A, TJ = 125°C 4.8 6.0 gFS Forward Transconductance VDS = 5 V, ID = 19 A 103 S Ciss Input Capacitance VDS = 15 V, VGS = 0 V, f = 1MHz 1715 2280 pF Coss Output Capacitance 655 870 pF Crss Reverse Transfer Capacitance 75 110 pF Rg Gate Resistance 0.7 2.5 Ω td(on) Turn-On Delay Time VDD = 15 V, ID = 19 A, VGS = 10 V, RGEN = 6 Ω 9.0 18 ns tr Rise Time 3.9 10 ns td(off) Turn-Off Delay Time 25 40 ns tf Fall Time 3.2 10 ns Qg Total Gate Charge VGS = 0 V to 10 V VDD = 15 V, ID = 19 A 27 37 nC Qg Total Gate Charge VGS = 0 V to 4.5 V13 19 nC Qgs Gate to Source Charge 4.2 nC Qgd Gate to Drain “Miller” Charge 3.7 nC VSD Source-Drain Diode Forward Voltage VGS = 0 V, IS = 2 A (Note 2) 0.6 0.8 V VGS = 0 V, IS = 19 A (Note 2) 0.8 1.2 trr Reverse Recovery Time IF = 19 A, di/dt = 300 A/μs 24 38 ns Qrr Reverse Recovery Charge 24 38 nC Notes: 1. RθJA is determined with the device mounted on a 1 in 2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by the user's board design. 2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. 3. EAS of 33 mJ is based on starting TJ = 25 °C, L = 0.3 mH, IAS = 15 A, VDD = 27 V, VGS = 10 V. 4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse occurrence only. No continuous rating is implied. a. 50 °C/W when mounted on a 1 in2 pad of 2 oz copper. b. 125 °C/W when mounted on a minimum pad of 2 oz copper. |
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