LM4308

www.ti.com

SNLS225C – AUGUST 2007 – REVISED MAY 2013

Pin Descriptions (continued)

Description

No.

No.

Pin Name

of Pads

of Pins

CPU Master

CPU Slave

uArray

WQFN

(MST)

(SLV)

DAP

NA

*

Connect to Ground - WQFN Package

1

Table 1. PLLCON[1:0] - PLL Multiplier Settings

PLLCON1

PLLCON0

Multiplier

L

L

8X

L

H

10X

H

L

12X

H

H

Reserved

Table 2. RDS[1:0] - Receiver Output Drive Strength

RDS1

RDS0

Result

L

L

L

H

Increased drive on DATA, AD, and CS1*/CS2* outputs

H

L

Increased drive on WR* and RD*

H

H

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2)

−0.3V to +2.2V

−0.3V to +2.2V

−0.3V to +3.6V

LVCMOS Input/Output Voltage

CLK LVCMOS Input Voltage

−0.3V to +3.3V

SLVS Input/Output Voltage

Junction Temperature

+150°C

Storage Temperature

−65°C to +150°C

ESD Ratings:

HBM, 1.5 k

Ω, 100 pF

≥±2 kV

EIAJ, 0

Ω, 200 pF

≥±200V

Maximum Package Power Dissipation Capacity at

NYC Package

2.75 W

25°C

Derate NYC Package above 25°C

22 mW/°C

RSB Package

3.43 W

Derate RSB Package above 25°C

27 mW/°C

(1)

“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be specified. They are not meant to imply

that the device should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

RECOMMENDED OPERATING CONDITIONS

Min

Typ

Max

Units

Supply Voltage

1.6

1.8

2.0

V

1.6

3.0

V

Clock Frequency

9.6

30

MHz

DC (Serial) Clock Frequency

76.8

240

MHz

Ambient Temperature

−40

25

85

°C

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3

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