Data Sheet

ADMP510

Rev. 0 | Page 9 of 12

HANDLING INSTRUCTIONS

PICK-AND-PLACE EQUIPMENT

The MEMS microphone can be handled using standard pick-

and-place and chip shooting equipment. Take care to avoid

damage to the MEMS microphone structure as follows:

•

Use a standard pickup tool to handle the microphone.

Because the microphone hole is located on the bottom

surface of the package (see Figure 2), the pickup tool can

make contact with any part of the top lid surface.

•

Do not pick up the microphone with a vacuum tool that

makes contact with the bottom side of the microphone.

•

Do not use excessive force to place the microphone on

the PCB.

REFLOW SOLDER

For best results, the soldering profile should be in accordance

with the recommendations of the manufacturer of the solder

paste used to attach the MEMS microphone to the PCB. It is

recommended that the solder reflow profile not exceed the limit

conditions specified in Figure 3 and Table 3.

BOARD WASH

When washing the PCB, ensure that water does not make contact

with the microphone port. Do not use blow-off procedures or

ultrasonic cleaning.