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ADM1069ACPZ bảng dữ liệu(PDF) 7 Page - Analog Devices

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ADM1069ACPZ bảng dữ liệu(HTML) 7 Page - Analog Devices

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ADM1069
Rev. C | Page 7 of 32
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Voltage on VH Pin
16 V
Voltage on VPx Pins
7 V
Voltage on VXx Pins
−0.3 V to +6.5 V
Voltage on A0, A1 Pins
−0.3 V to +7 V
Voltage on REFIN, REFOUT Pins
5 V
Voltage on VDDCAP, VCCP Pins
6.5 V
Voltage on DACx Pins
6.5 V
Voltage on PDOx Pins
16 V
Voltage on SDA, SCL Pins
7 V
Voltage on GND, AGND, PDOGND,
REFGND Pins
−0.3 V to +0.3 V
Input Current at Any Pin
±5 mA
Package Input Current
±20 mA
Maximum Junction Temperature (TJ max)
150°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature
Soldering Vapor Phase, 60 sec
215°C
ESD Rating, All Pins
2000 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
Unit
32-Lead LQFP
54
°C/W
40-Lead LFCSP
25
°C/W
ESD CAUTION



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