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MPC8536DS bảng dữ liệu(PDF) 112 Page - Freescale Semiconductor, Inc

tên linh kiện MPC8536DS
Giải thích chi tiết về linh kiện  MPC8536E PowerQUICC III Integrated Processor Hardware Specifications
PDF  126 Pages
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
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MPC8536DS bảng dữ liệu(HTML) 112 Page - Freescale Semiconductor, Inc

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MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Electrical Characteristics
Freescale Semiconductor
112
Figure 72. System-Level Thermal Model for the Chip (Not to Scale)
The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer for flow over the part
in standard JEDEC environments, as well as the heat spreading in the board under the package. In a real system, however, the
part will require a heat sink to be mounted on it. In this case, the predominant heat flow path will be from the die to the heat
sink. Grid density lower than currently in the package library file will suffice for these simulations. The user will need to
determine the optimal grid for their specific case.
2.24.3
Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,
and thermal interface material.
Solder and Air (29
× 29 × 0.5 mm)
Kx
0.034
W/m•K
Ky
0.034
Kz
12.1
Table 80. Thermal Model (continued)
Conductivity
Value
Units



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