VDD

HB

HO

HS

LO

VSS

LI

HI

MSOP-

PowerPad-8

Exposed Pad

Connect to VSS

HO

3

HS

4

VDD

1

HB

2

8

LO

7

VSS

6

LI

5

HI

SO

PowerPad-8

WSON-10

1

2

3

4

9

6

7

8

VDD

HB

HO

HS

HI

LI

VSS

LO

NC

5

10

NC

WSON-8

1

2

3

4

5

6

7

8

VDD

HB

HO

HS

HI

LI

VSS

LO

VDD

HB

HO

HS

LO

VSS

LI

HI

1

8

2

7

3

6

4

5

SOIC-8

LM5100A, LM5100B, LM5100C, LM5101A, LM5101B, LM5101C

SNOSAW2P – SEPTEMBER 2006 – REVISED MARCH 2013

www.ti.com

Table 1. Input/Output Options

Part Number

Input Thresholds

Peak Output Current

LM5100A

CMOS

3A

LM5101A

TTL

3A

LM5100B

CMOS

2A

LM5101B

TTL

2A

LM5100C

CMOS

1A

LM5101C

TTL

1A

Connection Diagrams

Pin #

SO

MSOP-

Name

Description

Application Information

WSON-

WSON-

SOIC-8

Power

PowerPad

Pad-8

Positive gate

Locally decouple to VSS using low ESR/ESL

1

1

1

1

1

VDD

drive supply

capacitor located as close to the IC as possible.

Connect the positive terminal of the bootstrap

High-side gate

capacitor to HB and the negative terminal to HS. The

2

2

2

2

2

HB

driver bootstrap

bootstrap capacitor should be placed as close to the

rail

IC as possible.

High-side gate

Connect to the gate of high-side MOSFET with a

3

3

3

3

3

HO

driver output

short, low inductance path.

(1)

Note: For WSON-8, WSON-10 and MSOP-PowerPad-8 package, it is recommended that the exposed pad on the bottom of the

package is soldered to ground plane on the PC board, and that ground plane should extend out from beneath the IC to help

dissipate heat. For WSON-10 package, pins 5 and 6 have no connection.

2

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