LM4889MASLASHNOPB datasheet(3/27 Pages) TI

3 / 27 page

LM4889

www.ti.com

SNAS157H – APRIL 2002 – REVISED MAY 2013

Absolute Maximum Ratings

(1) (2)

Supply Voltage

6.0V

Storage Temperature

−65°C to +150°C

Input Voltage

−0.3V to VDD +0.3V

Power Dissipation(3)

Internally Limited

ESD Susceptibility(4)

2000V

ESD Susceptibility(5)

200V

Junction Temperature

150°C

Thermal Resistance

θJC (SOIC)

35°C/W

θJA (SOIC)

150°C/W

θJA (8 Bump DSBGA)

(6)

210°C/W

θJC (VSSOP)

56°C/W

θJA (VSSOP)

190°C/W

θJA (WSON)

220°C/W

Soldering Information

See the AN-1112 Application Report.

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical

specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the

Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication

of device performance.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature

TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever

is lower. For the LM4889, see power derating currents for additional information.

(4)

Human body model, 100 pF discharged through a 1.5 k

Ω resistor.

(5)

Machine Model, 220 pF–240 pF discharged through all pins.

(6)

All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance. The LM4889ITL demo board

(views featured in the Application Information section) has two inner layers, one for VDD and one for GND. The planes each measure

600mils x 600mils (15.24mm x 15.24mm) and aid in spreading heat due to power dissipation within the IC.

Operating Ratings

Temperature Range TMIN ≤ TA ≤ TMAX

−40°C ≤ TA ≤ 85°C

Supply Voltage

2.2V

≤ VDD ≤ 5.5V

Electrical Characteristics VDD = 5V

(1) (2)

The following specifications apply for VDD = 5V, AV = 2, and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.

LM4889

Units

Symbol

Parameter

Conditions

(Limits)

Typical(3)

Limit(4)(5)

VIN = 0V, Io = 0A, no Load

mA (max)

IDD

Quiescent Power Supply Current

VIN = 0V, Io = 0A, with BTL Load

mA (max)

ISD

Shutdown Current

Vshutdown = GND

(6)

0.1

µA (max)

VSDIH

Shutdown Voltage Input High

1.2

V (min)

VSDIL

Shutdown Voltage Input Low

0.4

V (max)

Output Power

THD = 2% (max); f = 1 kHz

THD+N

Total Harmonic Distortion+Noise

Po = 0.4 Wrms; f = 1kHz

0.1

(1)

All voltages are measured with respect to the ground pin, unless otherwise specified.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical

specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the

Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication

of device performance.

(3)

Typicals are measured at 25°C and represent the parametric norm.

(4)

Limits are specified to TI's AOQL (Average Outgoing Quality Level).

(5)

Datasheet min/max specification limits are specified by design, test or statistical analysis.

(6)

For DSBGA only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a

maximum of 2µA.

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