LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

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LM317A and LM317-N Electrical Characteristics

(1) (continued)

LM317A

LM317-N

Parameter

Conditions

Min

Typ

Max

Min

Typ

Max

Units

NDS (TO-3) Package

-

2

NDE (TO-220) Package

4

4

KTT (TO-263) Package

-

4

Thermal Resistance,

°C/W

Junction-to-Case

DCY (SOT-223) Package

23.5

23.5

NDT (TO) Package

21

21

MDT (PFM) Package

12

12

NDS (TO-3) Package

-

39

NDE (TO-220) Package

50

50

Thermal Resistance,

-

50

Junction-to-Ambient (No

°C/W

140

140

Heat Sink)

NDT (TO) Package

186

186

103

103

(3)

When surface mount packages are used (TO-263, SOT-223, PFM), the junction to ambient thermal resistance can be reduced by

increasing the PC board copper area that is thermally connected to the package. See the Applications Hints section for heatsink

techniques.

6

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