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ADR421ARMZ bảng dữ liệu(PDF) 16 Page - Analog Devices |
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ADR421ARMZ bảng dữ liệu(HTML) 16 Page - Analog Devices |
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16 / 24 page ![]() ADR420/ADR421/ADR423/ADR425 Rev. I | Page 16 of 24 THEORY OF OPERATION The ADR42x series of references uses a reference generation technique known as XFET (eXtra implanted junction FET). This technique yields a reference with low supply current, good thermal hysteresis, and exceptionally low noise. The core of the XFET reference consists of two junction field-effect transistors (JFET), one having an extra channel implant to raise its pinch- off voltage. By running the two JFETs at the same drain current, the difference in pinch-off voltage can be amplified and used to form a highly stable voltage reference. The intrinsic reference voltage is about 0.5 V with a negative temperature coefficient of about −120 ppm/°C. This slope is essentially constant to the dielectric constant of silicon and can be closely compensated by adding a correction term generated in the same fashion as the proportional-to-temperature (PTAT) term used to compensate band gap references. The primary advantage over a band gap reference is that the intrinsic tem- perature coefficient is approximately 30 times lower (therefore requiring less correction). This results in much lower noise because most of the noise of a band gap reference comes from the temperature compensation circuitry. Figure 38 shows the basic topology of the ADR42x series. The temperature correction term is provided by a current source with a value designed to be proportional to absolute tempera- ture. The general equation is VOUT = G × (ΔVP − R1 × IPTAT) (1) where: G is the gain of the reciprocal of the divider ratio. ΔVP is the difference in pinch-off voltage between the two JFETs. IPTAT is the positive temperature coefficient correction current. Each ADR42x device is created by on-chip adjustment of R2 and R3 to achieve the specified reference output. * R3 GND *EXTRA CHANNEL IMPLANT VOUT = G(∆VP – R1 × IPTAT) R2 IPTAT ∆VP R1 VIN VOUT ADR420/ADR421/ ADR423/ADR425 I1 I1 Figure 38. Simplified Schematic DEVICE POWER DISSIPATION CONSIDERATIONS The ADR42x family of references is guaranteed to deliver load currents to 10 mA with an input voltage that ranges from 4.5 V to 18 V. When these devices are used in applications at higher currents, the following equation should be used to account for the temperature effects due to power dissipation increases: TJ = PD × θJA + TA (2) where: TJ and TA are the junction temperature and the ambient temperature, respectively. PD is the device power dissipation. θJA is the device package thermal resistance. BASIC VOLTAGE REFERENCE CONNECTIONS Voltage references, in general, require a bypass capacitor connected from VOUT to GND. The circuit in Figure 39 illustrates the basic configuration for the ADR42x family of references. Other than a 0.1 μF capacitor at the output to help improve noise suppression, a large output capacitor at the output is not required for circuit stability. NIC = NO INTERNAL CONNECTION TP = TEST PIN (DO NOT CONNECT) ADR420/ ADR421/ ADR423/ ADR425 TOP VIEW (Not to Scale) TP 1 VIN 2 NIC 3 4 TP 8 NIC 7 OUTPUT 6 TRIM 5 0.1µF 0.1µF 10µF + Figure 39. Basic Voltage Reference Configuration NOISE PERFORMANCE The noise generated by ADR42x references is typically less than 2 μV p-p over the 0.1 Hz to 10 Hz band for the ADR420, ADR421, and ADR423. Figure 24 shows the 0.1 Hz to 10 Hz noise of the ADR421, which is only 1.75 μV p-p. The noise measurement is made with a band-pass filter made of a 2-pole high-pass filter with a corner frequency at 0.1 Hz and a 2-pole low-pass filter with a corner frequency at 10 Hz. TURN-ON TIME At power-up (cold start), the time required for the output voltage to reach its final value within a specified error band is defined as the turn-on settling time. Two components typi- cally associated with this are the time for the active circuits to settle and the time for the thermal gradients on the chip to stabilize. Figure 31 to Figure 35 show the turn-on settling time for the ADR421. |
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