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MCP6H74-E/ST bảng dữ liệu(PDF) 15 Page - Microchip Technology

tên linh kiện MCP6H74-E/ST
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 2012 Microchip Technology Inc.
DS22325B-page 15
MCP6H71/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
3.1
Analog Outputs
The output pins are low-impedance voltage sources.
3.2
Analog Inputs
The
non-inverting
and
inverting
inputs
are
high-impedance CMOS inputs with low bias currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 3.5V to 12V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts can be used in single-supply
operation or dual-supply operation. Also, VDD will need
bypass capacitors.
3.4
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (
JA).
TABLE 3-1:
PIN FUNCTION TABLE
MCP6H71
MCP6H72
MCP6H74
Symbol
Description
SOIC
2x3 TDFN
SOIC
2x3 TDFN
SOIC,
TSSOP
66
1
1
1
VOUT, VOUTA
Analog Output (op amp A)
22
2
2
2
VIN–, VINA–
Inverting Input (op amp A)
33
3
3
3
VIN+, VINA+
Non-inverting Input (op amp A)
77
8
8
4
VDD
Positive Power Supply
——
5
5
5
VINB+
Non-inverting Input (op amp B)
——
6
6
6
VINB–
Inverting Input (op amp B)
——
7
7
7
VOUTB
Analog Output (op amp B)
——
—
—
8
VOUTC
Analog Output (op amp C)
——
—
—
9
VINC–
Inverting Input (op amp C)
——
—
—
10
VINC+
Non-Inverting Input (op amp C)
44
4
4
11
VSS
Negative Power Supply
——
—
—
12
VIND+
Non-Inverting Input (op amp D)
——
—
—
13
VIND–
Inverting Input (op amp D)
——
—
—
14
VOUTD
Analog Output (op amp D)
1, 5, 8
1, 5, 8
—
—
—
NC
No Internal Connection
—
9
—
9
—
EP
Exposed Thermal Pad (EP);
must be connected to VSS.



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