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SST12LP19E bảng dữ liệu(PDF) 20 Page - Microchip Technology |
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SST12LP19E bảng dữ liệu(HTML) 20 Page - Microchip Technology |
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20 / 23 page ![]() ©2013 Silicon Storage Technology, Inc. DS70005041C 05/13 20 2.4 GHz High-Power, High-Gain Power Amplifier SST12LP19E Data Sheet Figure 20:6-Contact Extremely-thin Quad Small Outline No-lead (XSON) SST Package Code: QX6 TOP VIEW BOTTOM VIEW SIDE VIEW 0.50 0.40 0.75 Pin # 1 1.50 ±0.10 Pin #1 (laser engraved) 1.50 ±0.10 0.50 BSC 0.20 0.20 6-xson-1.5x1.5-QX6-1.0 1mm 0.05 Max 0.70 See notes 2 and 3 1.20 Note: 1. Similar to JEDEC JEP95 XQFN/XSON variants, though number of contacts and some dimensions are different. 2. From the bottom view, the pin #1 indicator may be either a curved indent or a 45-degree chamfer. 3. The external paddle is electrically connected to the die back-side and to VSS. This paddle must be soldered to the PC board; it is required to connect this paddle to the VSS of the unit. Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of the device. 4. Untoleranced dimensions are nominal target dimensions. 5. All linear dimensions are in millimeters (max/min). |
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