SST12LF09 datasheet(12/15 Pages) MICROCHIP

tên linh kiện	SST12LF09

Giải thích chi tiết về linh kiện	2.4 GHz High-Gain, High-Efficiency Front-end Module

PDF	15 Pages

Scroll/Zoom	100%

nhà sản xuất	MICROCHIP [Microchip Technology]

Trang chủ	http://www.microchip.com

Logo

12 / 15 page

SST12LF09

DS75083A-page 12

 2013 Microchip Technology Inc.

8.0

PACKAGING DIAGRAMS

FIGURE 8-1:

16-CONTACT SUPER-THIN QUAL FLAT NO-LEAD (XQFN)

PACKAGE CODE: Q3C

TABLE 8-1:

REVISION HISTORY

Revision

Description

Date

•

Initial release of data sheet

May 2013

Note: 1. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.

2. The topside pin #1 indicator is laser engraved; its approximate shape and location is as shown.

3. The external paddle is electrically connected to the die back-side and to VSS.

This paddle must be soldered to the PC board; it is required to connect this paddle to the VSS of the unit.

Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of the device.

4. Untoleranced dimensions are nominal target dimensions.

5. All linear dimensions are in millimeters (max/min).

16-x2qfn-2.5x2.5-Q3C-2.0

0.5 BSC

See notes

2 and 3

Pin #1

0.25

0.15

0.075

0.127

0.275

0.175

TOP VIEW

BOTTOM VIEW

SIDE VIEW

1 mm

2.50

± 0.05

2.50

± 0.05

Pin #1

(laser

engraved

see note 2)

1.35

0.40

0.34

0.05 Max

SST12LF09 bảng dữ liệu(PDF) 12 Page - Microchip Technology

SST12LF09 bảng dữ liệu(HTML) 12 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

bảng dữ liệu tải về

Link URL