3

Absolute Maximum Ratings

These are stress ratings only and functional operation is not implied

Exposure to absolute

maximum ratings for prolonged time periods may affect device reliability

All voltages are with

respect to ground

.

.

.

Input Voltage..................................-0.3V to 6.0V

EN, FB Pin Voltage.............................-

SW Pi n Voltage.....................-

0.3V to V

0.3V to

V +0.3V

Junction Temperature................................150°C

Storage Temperature Range........-65°C to 150°C

Soldering Temperature......................300°C 5sec

(

)

IN

IN

,

Recommended Operating Conditions

Supply Voltage................................2.5V to 5.5V

°C

°C

°C

°C

Operation Temperature Range.........-40

to 85

Junction Temperature Range........-40

to 125

Thermal Information

Par ameter

Symbol

Package

Maximum

Unit

TSOT23-5

Note

130

TDFN22-8

23.4

Thermal Resistance

(Junction to Case)

TDFN22-6

25

TSOT23-5

250

TDFN22-8

70

Thermal Resistance

(Junction to Ambient)

θ

JA

TDFN22-6

68

°C/W

TSOT23-5

400

TDFN22-8

1400

Internal Power Dissipation

( TA=25°C)

TDFN22-6

980

mW

,

Power Analog Microelectronics Inc

www.poweranalog.com

PAM2304

3MHz, 1A Step-Down DC-DC Converter

Note:

The maximun output current for TSOT23-5 package is limited by internal power dissipation capacity a s

described in Application Information hereinafter.

11/2011 Rev1.1

TSOT23

TDFN22-8

TDFN22-6

Name

Function

1

8

4

EN

Enable control input. Force this pin voltage above 1.5V, enables

the chip, and below 0.3V s huts down the device.

2

-

6

GND

Ground

3

5,6

1

SW

The drains of the internal main and synchronous power MOSFET.

4

3

5

VIN

Chip main power supply pin

5

1

3

FB

Feedback voltage to internal error amplifier, the threshold voltage

is 0.6V.

-

2

-

AGND

Analog ground.

-

4

-

PGND

Main power ground return pin.

-

7

2

NC

No connected

Pin Description