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AV02-1250EN - May 12, 2008

Recommended SMT Attachment

The VMMK Packaged Devices are compatible with high

volume surface mount PCB assembly processes.

Manual Assembly for Prototypes

1. Follow ESD precautions while handling packages.

2. Handling should be along the edges with tweezers or

from topside if using a vacuum collet.

3. Recommended attachment is solder paste. Please

see Figure 8 for recommended solder reflow profile.

Conductiveepoxyisnotrecommended.Handsoldering

is not recommended.

4. Apply solder paste using either a stencil printer or

dot placement. The volume of solder paste will be

dependent on PCB and component layout and should

be controlled to ensure consistent mechanical and

electrical performance. Excessive solder will degrade

RF performance.

5. Follow solder paste and vendor’s recommendations

when developing a solder reflow profile. A standard

profile will have a steady ramp up from room

temperature to the pre-heat temp to avoid damage

due to thermal shock.

6. Packages have been qualified to withstand a peak

temperature of 260ºC for 20 to 40 sec. Verify that the

profile will not expose device beyond these limits.

7. Clean off flux per vendor’s recommendations.

8. Clean the module with Acetone. Rinse with alcohol.

Allow the module to dry before testing.

0.5mm

1.05mm

BYYY

0.2mm

0.3mm

0.7mm

0.8mm

0

50

100

150

200

250

300

0

50

100

150

200

250

300

SECONDS

Ramp 1 Preheat Ramp 2 Reflow

Peak = 250 ± 5 °C

Melting point = 218 °C

Cooling

Figure 2. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste

Outline Drawing

Top and Side View

Bottom View

Notes:

1. • indicates pin 1

2. Dimensions are in millimeters

3. Pad Material is minimum 5.0 um thick Au

Notes:

1. 0.010” Rogers RO4350

Suggested PCB Material and Land Pattern

.014 [0.356]

.010 [0.254]

.020 [0.508]

.005 [0.127]

.008 [0.203]

.022 [0.559]

.014 [0.356]