B1069 datasheet(9/24 Pages) ETC1

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3 Melt the solder.

• Apply the nozzle to the soldered

part and melt the solder.

CAUTION

Never allow the nozzle to touch the

board itself.

• Conﬁrm that the solder is melted.

CAUTION

To conﬁrm that all solder is melted,

observe the inside of the hole and

the backside of the P.W.B. If this is

difﬁcult to do, try slowly moving the

lead with the nozzle – If the lead

moves, the solder is melted.

CAUTION

Never move the lead by force. If it

doesnʼt move easily, the solder isnʼt

yet fully melted.

4 Absorb the solder.

• After conﬁrming that the solder

is completely melted, absorb the

solder by squeezing the trigger on

the gun.

CAUTION

Never leave any solder remaining

inside the hole in the P.W.B.

• After fully absorbing all the solder,

cool the soldering junction in

order to prevent it from becoming

resoldered.

5 Problems during

desoldering.

• If solder remains, resolder the

component and repeat the desol-

dering process.

Nozzle

P.W.B.

Solder

Lead

Slowly move

the lead with

the nozzle.

Absorb the solder by slowly

moving the lead back and

forth with the tip of the

nozzle.

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