LM4871MM datasheet(5/23 Pages) TI1

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LM4871

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SNAS002F – FEBRUARY 2000 – REVISED MAY 2013

Typical Performance Characteristics

NGN Specific Characteristics

LM4871LD THD+N vs Output Power

LM4871LD THD+N vs Frequency

Figure 4.

Figure 5.

LM4871LD THD+N vs Frequency

LM4871LD THD+N vs Output Power

Figure 6.

Figure 7.

LM4871LD Power Dissipation vs Output Power

LM4871LD Power Derating Curve

This curve shows the LM4871LD's thermal dissipation ability at

different ambient temperatures given the exposed-DAP of the part is

soldered to a plane of 1oz. Cu with an area given in the label of each

curve. This label also designates whether the plane exists on the

same (top) layer as the chip, on the bottom layer, or on both layers.

Infinite heatsink and unattached (no heatsink) conditions are also

shown.

Figure 8.

Figure 9.

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